00001 /***************************************************************************** 00002 * McPAT 00003 * SOFTWARE LICENSE AGREEMENT 00004 * Copyright 2009 Hewlett-Packard Development Company, L.P. 00005 * All Rights Reserved 00006 * 00007 * Permission to use, copy, and modify this software and its documentation is 00008 * hereby granted only under the following terms and conditions. Both the 00009 * above copyright notice and this permission notice must appear in all copies 00010 * of the software, derivative works or modified versions, and any portions 00011 * thereof, and both notices must appear in supporting documentation. 00012 * 00013 * Any User of the software ("User"), by accessing and using it, agrees to the 00014 * terms and conditions set forth herein, and hereby grants back to Hewlett- 00015 * Packard Development Company, L.P. and its affiliated companies ("HP") a 00016 * non-exclusive, unrestricted, royalty-free right and license to copy, 00017 * modify, distribute copies, create derivate works and publicly display and 00018 * use, any changes, modifications, enhancements or extensions made to the 00019 * software by User, including but not limited to those affording 00020 * compatibility with other hardware or software, but excluding pre-existing 00021 * software applications that may incorporate the software. User further 00022 * agrees to use its best efforts to inform HP of any such changes, 00023 * modifications, enhancements or extensions. 00024 * 00025 * Correspondence should be provided to HP at: 00026 * 00027 * Director of Intellectual Property Licensing 00028 * Office of Strategy and Technology 00029 * Hewlett-Packard Company 00030 * 1501 Page Mill Road 00031 * Palo Alto, California 94304 00032 * 00033 * The software may be further distributed by User (but not offered for 00034 * sale or transferred for compensation) to third parties, under the 00035 * condition that such third parties agree to abide by the terms and 00036 * conditions of this license. 00037 * 00038 * THE SOFTWARE IS PROVIDED "AS IS" WITH ANY AND ALL ERRORS AND DEFECTS 00039 * AND USER ACKNOWLEDGES THAT THE SOFTWARE MAY CONTAIN ERRORS AND DEFECTS. 00040 * HP DISCLAIMS ALL WARRANTIES WITH REGARD TO THE SOFTWARE, INCLUDING ALL 00041 * IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS. IN NO EVENT SHALL 00042 * HP BE LIABLE FOR ANY SPECIAL, DIRECT, INDIRECT, OR CONSEQUENTIAL DAMAGES 00043 * OR ANY DAMAGES WHATSOEVER RESULTING FROM LOSS OF USE, DATA OR PROFITS, 00044 * WHETHER IN AN ACTION OF CONTRACT, NEGLIGENCE OR OTHER ACTION, ARISING 00045 * OUT OF OR IN CONNECTION WITH THE USE OR PERFORMANCE OF THE SOFTWARE. 00046 * 00047 ***************************************************************************/ 00048 #ifndef __INTERCONNECT_H__ 00049 #define __INTERCONNECT_H__ 00050 00051 #include "basic_circuit.h" 00052 #include "McPATcomponent.h" 00053 #include "parameter.h" 00054 #include "assert.h" 00055 #include "subarray.h" 00056 #include "cacti_interface.h" 00057 #include "wire.h" 00058 00059 // leakge power includes entire htree in a bank (when uca_tree == false) 00060 // leakge power includes only part to one bank when uca_tree == true 00061 00062 class interconnect : public McPATComponent 00063 { 00064 public: 00065 interconnect( 00066 string name_, 00067 double base_w, double base_h, int data_w, double len, 00068 const InputParameter *configure_interface, int start_wiring_level_, 00069 enum Wire_type wire_model=Global, 00070 double width_s=1.0, double space_s=1.0, 00071 TechnologyParameter::DeviceType *dt = &(g_tp.peri_global)); 00072 00073 ~interconnect() {}; 00074 00075 void compute(); 00076 string name; 00077 double in_rise_time, out_rise_time; 00078 InputParameter l_ip; 00079 uca_org_t local_result; 00080 void set_in_rise_time(double rt) 00081 { 00082 in_rise_time = rt; 00083 } 00084 00085 double max_unpipelined_link_delay; 00086 powerDef power_bit; 00087 00088 double wire_bw; 00089 double init_wire_bw; // bus width at root 00090 double base_width; 00091 double base_height; 00092 int data_width; 00093 enum Wire_type wt; 00094 double width_scaling, space_scaling; 00095 int start_wiring_level; 00096 double length; 00097 double min_w_nmos; 00098 double min_w_pmos; 00099 double latency, throughput; 00100 bool latency_overflow;//throughput_overflow=false, 00101 double interconnect_latency;// interconnect_throughput; 00102 00103 private: 00104 TechnologyParameter::DeviceType *deviceType; 00105 00106 }; 00107 00108 #endif 00109