Data Fields |
|
double | t_chip |
|
double | thermal_threshold |
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double | c_convec |
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double | r_convec |
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double | s_sink |
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double | t_sink |
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double | s_spreader |
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double | t_spreader |
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double | t_interface |
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double | ambient |
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char | init_file [STR_SIZE] |
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double | init_temp |
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char | steady_file [STR_SIZE] |
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double | sampling_intvl |
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double | base_proc_freq |
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int | dtm_used |
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char | model_type [STR_SIZE] |
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int | block_omit_lateral |
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int | grid_rows |
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int | grid_cols |
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char | grid_layer_file [STR_SIZE] |
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char | grid_steady_file [STR_SIZE] |
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char | grid_map_mode [STR_SIZE] |
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double | k_chip |
|
double | p_chip |
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double | k_sink |
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double | p_sink |
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double | k_spreader |
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double | p_spreader |
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double | k_interface |
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double | p_interface |
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int | model_secondary |
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double | r_convec_sec |
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double | c_convec_sec |
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int | n_metal |
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double | t_metal |
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double | t_c4 |
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double | s_c4 |
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int | n_c4 |
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double | s_sub |
|
double | t_sub |
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double | s_solder |
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double | t_solder |
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double | s_pcb |
|
double | t_pcb |
|
int | leakage_used |
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int | leakage_mode |
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int | package_model_used |
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char | package_config_file [STR_SIZE] |
The documentation for this struct was generated from the following files:
